IP Library Assignment 014653/0044
Patent Assignment
Reel/Frame 014653/0044

Assignment of Assignor's Interest

Recorded: 2004-05-25 Pages: 9
Assignor
Assignee
OMNIVISION INTERNATIONAL HOLDING LTD
SECOND FLOOR, ZEPHYR HOUSE, MARY STREET, P.O. BOX 709, GEORGE TOWN, GRAND CAYMAN, CAYMAN ISLAND, CAYMAN ISLANDS
Covered Properties (15)
Method and Apparatus for Printing Photographs from Digital Images Using Existing Dpe Mini Labs
Patent: 6,741,325 →
Application: 10/269,310 →
Publication: US 2004/0070739
Image Sensor Having Combination Color Filter and Concave-Shaped Micro-Lenses
Patent: 6,737,719 →
Application: 10/280,394 →
Publication: US 2004/0080005
Image sensor having concave-shaped micro-lenses
Application: 10/280,395 →
Publication: US 2004/0080006
Image Sensor Having Reduced Stress Color Filters and Method of Making
Patent: 6,800,838 →
Application: 10/280,396 →
Publication: US 2004/0080007
Image Sensor Having Micro-Lenses with Integrated Color Filter and Method of Making
Patent: 6,861,280 →
Application: 10/280,399 →
Publication: US 2004/0080008
Method of Forming Planar Color Filters in an Image Sensor
Patent: 6,699,729 →
Application: 10/280,490 →
Image Sensor Having Integrated Thin Film Infrared Filter
Patent: 6,818,962 →
Application: 10/280,497 →
Publication: US 2004/0082092
Image Sensor Having Large Micro-Lenses at the Peripheral Regions
Patent: 6,638,786 →
Application: 10/280,854 →
Publication: US 2003/0042490
Method for Making and Packaging Image Sensor Die Using Protective Coating
Patent: 6,808,960 →
Application: 10/280,974 →
Publication: US 2004/0082094
Dummy Pattern for Improving Micro-Lens Formation in an Image Sensor
Patent: 6,608,358 →
Application: 10/280,993 →
Method for forming an image sensor having concave-shaped micro-lenses
Application: 10/281,012 →
Publication: US 2004/0082096
Image sensor adapted for reduced component chip scale packaging
Application: 10/330,824 →
Publication: US 2004/0124486
Image Sensor Having Micro-Lens Array Separated with Trench Structures and Method of Making
Patent: 6,818,934 →
Application: 10/603,727 →
Image Sensor Having Micro-Lens Array Separated with Ridge Structures and Method of Making
Patent: 8,031,253 →
Application: 10/603,729 →
Publication: US 2004/0263665
Image sensor having large micro-lenses at the peripheral regions
Application: 10/637,177 →
Publication: US 2004/0082093
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 11, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 013389/0363 →
Assignment of Assignor's Interest Oct 25, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 013435/0613 →
Assignment of Assignor's Interest Oct 25, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 013435/0600 →
Assignment of Assignor's Interest Oct 25, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 013432/0077 →
Assignment of Assignor's Interest Oct 25, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGAI) CO., LTD.
Reel/Frame 013432/0093 →
Assignment of Assignor's Interest Oct 25, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 013432/0148 →
Assignment of Assignor's Interest Oct 25, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR CO., LTD.
Reel/Frame 013432/0253 →
Assignment of Assignor's Interest Oct 25, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 013433/0887 →
Assignment of Assignor's Interest Oct 25, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 013435/0213 →
Assignment of Assignor's Interest Oct 25, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 013435/0392 →
Assignment of Assignor's Interest Oct 25, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 013435/0219 →
Assignment of Assignor's Interest Dec 26, 2002
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 013954/0348 →
Assignment of Assignor's Interest Jun 24, 2003
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 014254/0966 →
Assignment of Assignor's Interest Jun 24, 2003
From: YAMAMOTO, KATSUMI
To: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
Reel/Frame 014240/0970 →
Assignment of Assignor's Interest Oct 27, 2003
From: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
To: OMNIVISION INTERNATIONAL HOLDING LTD
Reel/Frame 014624/0578 →