Patent Assignment
Reel/Frame 013954/0348
Assignment of Assignor's Interest
Recorded: 2002-12-26
Pages: 3
Assignor
YAMAMOTO, KATSUMI
Executed: 2002-12-23
Assignee
HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
1325 HUAIHAI M. ROAD, SUITE 1003, SHANGHAI, 200031, CHINA
Covered Property
(1)
Image sensor adapted for reduced component chip scale packaging
Application:
10/330,824 →
Publication:
US 2004/0124486
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 27, 2003
From: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
To: OMNIVISION INTERNATIONAL HOLDING LTD
Reel/Frame 014624/0578 →
Assignment of Assignor's Interest
May 25, 2004
From: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
To: OMNIVISION INTERNATIONAL HOLDING LTD
Reel/Frame 014653/0044 →