Patent Assignment
Reel/Frame 014240/0970
Assignment of Assignor's Interest
Recorded: 2003-06-24
Pages: 3
Assignor
YAMAMOTO, KATSUMI
Executed: 2003-06-10
Assignee
HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
1325 HUAIHAI M. ROAD, SUITE 1003, SHANGHAI, 200031, CHINA
Covered Property
(1)
Image Sensor Having Micro-Lens Array Separated with Trench Structures and Method of Making
Patent:
6,818,934 →
Application:
10/603,727 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 27, 2003
From: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
To: OMNIVISION INTERNATIONAL HOLDING LTD
Reel/Frame 014624/0578 →
Assignment of Assignor's Interest
May 25, 2004
From: HUA WEI SEMICONDUCTOR (SHANGHAI) CO., LTD.
To: OMNIVISION INTERNATIONAL HOLDING LTD
Reel/Frame 014653/0044 →