Patent Assignment
Reel/Frame 013440/0246
Assignment of Assignor's Interest
Recorded: 2002-10-30
Pages: 3
Assignor
NEC CORPORATION
Executed: 2002-09-19
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8666, JAPAN
Covered Properties
(5)
Organic Insulation Film Formation Method
Semiconductor Switches and Switching Circuits for Microwave
Application:
09/372,322 →
Publication:
US 2002/0149450
Method of Designing Circuit with Field Effect Transistor and Method of Determining Parameters of Model Used in Such Designing Method
Patent:
6,408,425 →
Application:
09/405,690 →
Embossed Carrier Tape, Method of Manufacturing the Same and the Metal Molds Used Herein
Application:
09/470,069 →
High-Frequency Variable Attenuator Having a Controllable Reference Voltage
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 11, 1999
From: KOHNO, MICHIHISA
To: NEC CORPORATION
Reel/Frame 010168/0199 →
Assignment of Assignor's Interest
Aug 11, 1999
From: MIZUTANI, HIROSHI
To: NEC CORPORATION
Reel/Frame 010167/0552 →
Assignment of Assignor's Interest
Sep 24, 1999
From: MIZUTANI, HIROSHI
To: NEC CORPORATION
Reel/Frame 010276/0588 →
Assignment of Assignor's Interest
Dec 22, 1999
From: HASHIZUME, SHOZI; NOMURA, YUKIO
To: NEC CORPORATION
Reel/Frame 010507/0189 →
Assignment of Assignor's Interest
Jan 16, 2001
From: NISHIBE, TOSHIAKI
To: NEC CORPORATION
Reel/Frame 011478/0595 →
Assignment of Assignor's Interest
Mar 29, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017727/0633 →
Assignment of Assignor's Interest
Apr 4, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017422/0528 →
Change of Name
Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0918 →