Patent Assignment
Reel/Frame 013451/0688
Assignment of Assignor's Interest
Recorded: 2002-10-30
Pages: 3
Assignors
WANG, TIE
Executed: 2002-10-22
MIAO, PING
Executed: 2002-10-22
LUM, CHUNG SING COLIN
Executed: 2002-10-22
CHEW, YIXIN
Executed: 2002-10-22
Assignee
ADVANPACK SOLUTIONS PTE. LTD.
33 MARSILING INDUSTRIAL ESTATE, ROAD 3 #03-01/03, SINGAPORE 739256, SINGAPORE
Covered Property
(1)
Method for Fabricating a Flip Chip Package with Pillar Bump and No Flow Underfill