Patent Assignment
Reel/Frame 013456/0201
Merger
Recorded: 2002-11-04
Received: 2002-11-08
Pages: 10
Assignor
MAXWELL ELECTRONIC COMPONENTS GROUP, INC.
Executed: 2002-10-07
Assignee
MAXWELL TECHNOLOGIES, INC.
9244 BALBOA AVENUE, SAN DIEGO, CA, 92123, UNITED STATES
Covered Properties
(8)
Method and Apparatus for Shielding an Integrated Circuit from Radiation
Application:
10/065,209 →
Multi-Electrode Double Layer Capacitor Having Hermetic Electrolyte Seal
Application:
10/236,793 →
Electrochemical Double Layer Capacitor Having Carbon Powder Electrodes
Application:
10/159,265 →
Electronic Device Packaging
Application:
10/075,706 →
Electrochemical Double Layer Capacitor Having Carbon Powder Electrodes
Application:
10/005,885 →
Radiation Shielding of Three Dimensional Multi-Chip Modules
Application:
09/878,683 →
Method of Making a Multi-Electrode Double Layer Capacitor Having Single Electrolyte Seal and Aluminum-Impregnated Carbon Cloth Electrodes
Application:
09/783,728 →
Low Resistance Bonding in a Multi-Electrode Double Layer Capacitor Having Single Electrolyte Seal and Aluminum-Impregnated Carbon Cloth Electrodes
Application:
09/782,577 →