Patent Assignment
Reel/Frame 013474/0168
Assignment of Assignor's Interest
Recorded: 2003-03-13
Pages: 3
Assignee
VIA TECHNOLOGIES, INC.
8F, NO. 533, CHUNG-CHENG RD., HSIN-TIEN CITY, TAIPEI HSIEN, TAIWAN
Covered Property
(1)
Chip Packaging Structure and Manufacturing Process Thereof