Patent Assignment
Reel/Frame 013574/0163
Assignment of Assignor's Interest
Recorded: 2002-12-10
Pages: 2
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
711 AZA SHARIDEN, OAZA KURITA, NAGANO-SHI, NAGANO, 380-0921, JAPAN
Covered Property
(1)
Semiconductor Device Package and Method of Production and Semiconductor Device of Same