Patent Assignment
Reel/Frame 013590/0962
Assignment of Assignor's Interest
Recorded: 2002-12-19
Received: 2002-12-23
Pages: 3
Assignor
KAITO, TAKASHI
Executed: 2002-11-26
Assignee
SEIKO INSTRUMENTS INC.
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, JPX, JAPAN
Covered Property
(1)
Method for Forming a Vertical Edge Submicron Through-Hole and a Thin Film Sample with This Kind of Through-Hole
Application:
10/001,332 →