IP Library Assignment 013592/0990
Patent Assignment
Reel/Frame 013592/0990

Assignment of Assignor's Interest

Recorded: 2002-12-11 Pages: 2
Assignors
MALHOTRA, SANDRA G.
Executed: 2002-12-06
SIMON, ANDREW H.
Executed: 2002-12-06
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Method for Depositing a Metal Layer on a Semiconductor Interconnect Structure
Patent: 6,949,461 →
Application: 10/318,605 →
Publication: US 2004/0115928
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 17, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: HFC SEMICONDUCTOR CORPORATION
Reel/Frame 055614/0001 →