Patent Assignment
Reel/Frame 055614/0001
Assignment of Assignor's Interest
Recorded: 2021-03-17
Pages: 4
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2021-02-15
Assignee
HFC SEMICONDUCTOR CORPORATION
NO. 116 LUAN ROAD, NANHUI NEW TOWN, PUDONG, SHANGHAI, 200135, CHINA
Covered Properties
(7)
Ultra-Thin Tantalum Nitride Copper Interconnect Barrier
Patent:
6,429,524 →
Application:
09/853,956 →
Method for Depositing a Metal Layer on a Semiconductor Interconnect Structure
Dual Damascene Wiring and Method
Dual Damascene Wiring and Method
Nitrogen-Containing Metal Cap for Interconnect Structures
Dual Fin Integration for Electron and Hole Mobility Enhancement
Dual Fin Integration for Electron and Hole Mobility Enhancement
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 11, 2001
From: COONEY, III., EDWARD C.; STAMPER, ANTHONY K.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 011816/0801 →
Assignment of Assignor's Interest
Dec 11, 2002
From: MALHOTRA, SANDRA G.; SIMON, ANDREW H.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 013592/0990 →
Assignment of Assignor's Interest
Jul 14, 2004
From: MCDEVITT, THOMAS L.; STAMPER, ANTHONY K.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 014848/0419 →
Assignment of Assignor's Interest
Aug 13, 2008
From: YANG, CHIH-CHAO; HU, CHAO-KUN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 021382/0837 →
Assignment of Assignor's Interest
Jul 26, 2016
From: CHEN, CHIA-YU; LIU, ZUOGUANG; WANG, MIAOMIAO; YAMASHITA, TENKO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039261/0471 →
Assignment of Assignor's Interest
Jul 26, 2016
From: CHEN, CHIA-YU; LIU, ZUOGUANG; WANG, MIAOMIAO; YAMASHITA, TENKO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039261/0494 →