IP Library › Assignment 039261/0494
Patent Assignment
Reel/Frame 039261/0494

Assignment of Assignor's Interest

Recorded: 2016-07-26 Pages: 8
Assignors
CHEN, CHIA-YU
Executed: 2015-02-12
LIU, ZUOGUANG
Executed: 2015-02-13
WANG, MIAOMIAO
Executed: 2015-02-12
YAMASHITA, TENKO
Executed: 2015-02-12
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Dual Fin Integration for Electron and Hole Mobility Enhancement
Patent: 9,704,867 →
Application: 15/219,922 →
Publication: US 2016/0336322
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 17, 2021
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: HFC SEMICONDUCTOR CORPORATION
Reel/Frame 055614/0001 →