Patent Assignment
Reel/Frame 013599/0888
Assignment of Assignor's Interest
Recorded: 2002-12-11
Received: 2002-12-31
Pages: 3
Assignor
NEC CORPORATION
Executed: 2002-11-14
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI, JPX, 211-8666, JAPAN
Covered Property
(1)
Multilayered wiring structure and method of manufacturing the same
Application:
09/891,415 →