IP Library Granted Patent US 6,351,026
Granted Patent Utility
US 6,351,026 · Confirmation No. 2635

Multilayered wiring structure and method of manufacturing the same

Inventors: Koki Hirasawa, Teruo Ono
⬇ PDF
Code Description Pages PDF
2004-08-25 WFEE Fee Worksheet (SB06) 1 View
2001-06-27 TRNA Transmittal of New Application 5 View
2001-06-27 A.PE Preliminary Amendment 5 View
2001-06-27 SPEC Specification 32 View
2001-06-27 CLM Claims 13 View
2001-06-27 ABST Abstract 1 View
2001-06-27 DRW Drawings-only black and white line drawings 6 View
2001-06-27 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,351,026
App. No.
09/891,415
Filed
2001-06-27
Granted
2002-02-26
Pub. No.
US20010038149A1
Examiner
ANYA, IGWE U
Art Unit
2825
PTA
0 days