Patent Assignment
Reel/Frame 013620/0571
Assignment of Assignor's Interest
Recorded: 2003-05-01
Received: 2003-05-01
Pages: 10
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JPX, JAPAN
Covered Properties
(4)
Ohmic Contact Plug Having an Improved Crack Free Tin Barrier Metal in a Contact Hole and Method of Forming the Same
Application:
09/974,808 →
Semiconductor Device Having a Silicide Layer with Silicon-Rich Region and Method for Making the Same
Application:
09/921,882 →
Optical semiconductor device, method for manufacturing the same, and optical module and optical communication apparatus provided with the optical semiconductor device
Application:
09/899,274 →
Semiconductor Device and Method and Apparatus for Manufacturing the Same
Application:
09/883,370 →