Patent Assignment
Reel/Frame 013636/0138
Corrective Assignment to Correct the Name of the Assignee, Filed 12/18/02 Recorded on Reel 013594 Frame 0054 Assignor Hereby Confirms the Assignment of the Entire Interest
Recorded: 2003-05-01
Pages: 5
Assignors
KATOU, KIYOHARU
Executed: 2002-10-28
MISHIMA, YOSHIYUKI
Executed: 2002-10-29
MATSUO, ITARU
Executed: 2002-10-29
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
MITSUBISHI ELECTRIC ENGINEERING COMPANY LIMITED
6-2, OOTEMACHI 2-CHOME CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Method for manufacturing a semiconductor device and a resin sealing device therefor
Application:
10/321,650 →
Publication:
US 2003/0180985
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 18, 2002
From: KATOU, KIYOHARU; MISHIMA, YOSHIYUKI; MATSUO, ITARU
To: MITUBISHI DENKI KABUSHIKI KAISHA; MITSUBISHI ELECTRIC ENGINEERING COMPANY LIMITED
Reel/Frame 013594/0054 →
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Corrective Assignment to Correct the Name of the First Assignee. Document Previously Recorded at Reel 013594 Frame 0054.
Dec 8, 2003
From: KATOU, KIYOHARU; MISHIMA, YOSHIYUKI; MATSUO, ITARU
To: MITSUBISHI DENKI KABUSHIKI KAISHA; MITSUBISHI ELECTRIC ENGINEERING COMPANY LIMITED
Reel/Frame 014760/0337 →
Assignment of Assignor's Interest
Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →