Patent Assignment
Reel/Frame 013639/0651
Assignment of Assignor's Interest
Recorded: 2003-05-09
Pages: 13
Assignors
POLYMERIC INTERCONNECT, INC.
Executed: 2003-04-09
CRAIG, HUGH P.
Executed: 2003-04-09
SUMMIT VALLEY TECHNOLOGIES
Executed: 2003-04-09
Assignee
DOW CORNING CORPORATION
2200 WEST SALZBURG ROAD, INTELLECTUAL PROPERTY DEPT, MAIL STOP CO1232, MIDLAND, MICHIGAN, 48686-0994
Covered Properties
(5)
Printable Compositions, and Their Application to Dielectric Surfaces Used in the Manufacture of Printed Circuit Boards
Patent:
7,022,266 →
Application:
09/242,388 →
Adhesive and Encapsulating Material with Fluxing Properties
Patent:
6,971,163 →
Application:
09/673,992 →
Variable frequency microwave annealing of conductive metal traces printed on printed circuit boards
Application:
10/392,425 →
Low resistance conductive composition
Application:
10/392,426 →
Long-fluxing conductive composition for permanently-low-resistance low-cost physical mounting and electrical connection of components to printed circuit boards
Application:
10/392,427 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 21, 2000
From: LOWRIE, DAVID JOHN JAMES
To: MULTICORE SOLDERS LIMITED
Reel/Frame 011402/0015 →
Assignment of Assignor's Interest
May 9, 2003
From: STEELE, DERRIL
To: CRAIG, HUGH P.
Reel/Frame 013639/0583 →
Change of Name
Feb 27, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045460/0278 →