Patent Assignment
Reel/Frame 013640/0973
Assignment of Assignor's Interest
Recorded: 2003-01-07
Pages: 3
Assignors
WU, ZHEN-CHENG
Executed: 2002-12-25
LU, YUNG-CHENG
Executed: 2002-12-25
CHEN, YING-TSUNG
Executed: 2002-12-25
JANG, SYUN-MING
Executed: 2002-12-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
121 PARK AVENUE 3, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Method of Forming Copper Interconnects