Patent Assignment
Reel/Frame 013661/0956
Assignment of Assignor's Interest
Recorded: 2003-05-16
Pages: 5
Assignors
SHIM, IL KWON
Executed: 2003-05-07
CHOW, SENG GUAN
Executed: 2003-05-07
ARARAO, VIRGIL COTOCO
Executed: 2003-05-07
ALVAREZ, SHEILA MARIE L.
Executed: 2003-05-07
EMIGH, ROGER
Executed: 2003-05-07
Assignee
ST ASSEMBLY TEST SERVICES LTD.
5 YISHUN ST. 23, 768442, SINGAPORE
Covered Property
(1)
Heat spreaders, heat spreader packages, and related fabrication methods for flip chip semiconductor devices
Application:
60/420,488 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the "Assignment Document" Specifically, the Address of the Assignee, This Assignment Was Previously Recorded at 013661/0956 (the Recordation Was Correct, However the "Assignment Document" Itself Had an Error Which as Sincebeen Corrected)
Jul 17, 2003
From: SHIM, II KWON; CHOW, SENG GUAN; ARARAO, VIRGIL COTOCO; ALVAREZ, SHEILA MARIE L.
To: ST ASSEMBLY TEST SERVICES LTD.
Reel/Frame 013808/0990 →
Corrective Assignment to Correct the First Name of the 1ST Conveying Parties to Il Kwon Shim. Previously Recorded at Reel/Frame 13808/0990.
Jul 18, 2003
From: SHIM, IL KWON; CHOW, SENG GUAN; ARARAO, VIRGIL COTOCO; ALVAREZ, SHEILIA MARIE L.
To: ST ASSEMBLY TEST SERVICES LTD.
Reel/Frame 013812/0030 →