Patent Application
Provisional
App. No. 60/420,488
· Confirmation No. 7674
Heat spreaders, heat spreader packages, and related fabrication methods for flip chip semiconductor devices
Provisional Application Expired
Inventors
II Kwon Shim
Singapore, SINGAPORE
Seng Guan Chow
Singapore, SINGAPORE
Virgil Cotoco Ararao
Singapore, SINGAPORE
Sheila Marie Alvarez
Singapore, SINGAPORE
Roger Emigh
Mesa, AZ
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-003P
- Confirmation No.
- 7674
CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST NAME OF THE 1ST CONVEYING PARTIES TO IL KWON SHIM. PREVIOUSLY RECORDED AT REEL/FRAME 13808/0990.
Recorded 2003-07-18
CORRECTIVE ASSIGNMENT TO CORRECT THE "ASSIGNMENT DOCUMENT" SPECIFICALLY, THE ADDRESS OF THE ASSIGNEE, THIS ASSIGNMENT WAS PREVIOUSLY RECORDED AT 013661/0956 (THE RECORDATION WAS CORRECT, HOWEVER THE "ASSIGNMENT DOCUMENT" ITSELF HAD AN ERROR WHICH AS SINCEBEEN CORRECTED)
Recorded 2003-07-17
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-05-16
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Quick Facts
- App. No.
- 60/420,488
- Filed
- 2002-10-21
External Links