Patent Assignment
Reel/Frame 013671/0292
Assignment of Assignor's Interest
Recorded: 2003-01-16
Pages: 3
Assignor
SAYAMA, TOMOHIRO
Executed: 2002-11-13
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Thermoplastic Resin Composition, Molding Made of the Thermoplastic Resin Composition and Process of Manufacturing the Molding
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 27, 2002
From: MATSUDA, YUSHI; HARA, MASAO; YAMAMOTO, KENICHI; KOODA, YUKI
To: MAZDA MOTOR CORPORATION
Reel/Frame 013613/0757 →
Change of Name
Jun 27, 2005
From: ARCO CHEMICAL TECHNOLOGY, L.P.
To: LYONDELL CHEMICAL TECHNOLOGY, L.P.
Reel/Frame 016206/0001 →
First Supplement to Security Agreement
Apr 30, 2019
From: GENBAND US LLC; RIBBON COMMUNICATIONS OPERATING COMPANY, INC., FORMERLY KNOWN AS SONUS NETWORKS, INC.
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 049035/0939 →
Termination and Release of First Supplement Ot Patent Security Agreement at R/F 049035/0939
Dec 6, 2021
From: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
To: RIBBON COMMUNICATIONS OPERATING COMPANY, INC. (F/K/A GENBAND US LLC AND SONUS NETWORKS, INC.)
Reel/Frame 058740/0265 →