IP Library › Assignment 013698/0635
Patent Assignment
Reel/Frame 013698/0635

Assignment of Assignor's Interest

Recorded: 2003-01-24 Pages: 3
Assignors
OTSUKA, SATOSHI
Executed: 2003-01-06
FUKUYAMA, SHUN-ICHI
Executed: 2003-01-07
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property (1)
Semiconductor Device Having Multilevel Copper Wiring Layers and Its Manufacture Method
Patent: 8,188,602 →
Application: 10/350,219 →
Publication: US 2003/0227086
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 5, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0876 →
Change of Name May 11, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024365/0875 →
Change of Address Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →