Patent Assignment
Reel/Frame 024365/0875
Change of Name
Recorded: 2010-05-11
Pages: 13
Assignor
FUJITSU MICROELECTRONICS LIMITED
Executed: 2010-04-01
Assignee
FUJITSU SEMICONDUCTOR LIMITED
2-10-23 SHIN-YOKOHAMA, KOHOKU-KU,, YOKOHAMA-SHI, KANAGAWA, 222-0033, JAPAN
Covered Property
(1)
Semiconductor Device Having Multilevel Copper Wiring Layers and Its Manufacture Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 24, 2003
From: OTSUKA, SATOSHI; FUKUYAMA, SHUN-ICHI
To: FUJITSU LIMITED
Reel/Frame 013698/0635 →
Assignment of Assignor's Interest
Dec 5, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0876 →
Change of Address
Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →