Patent Assignment
Reel/Frame 013700/0267
Assignment of Assignor's Interest
Recorded: 2003-06-02
Pages: 2
Assignor
NEC CORPORATION
Executed: 2003-05-20
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Properties
(3)
Method of forming a highly integrated non-volatile semiconductor memory device
Application:
10/256,130 →
Publication:
US 2003/0030145
Transcribing original substrate for a wiring pattern
Application:
10/307,931 →
Publication:
US 2003/0075798
Method and system for compensating exposure value for exposure process as well as exposure system and semiconductor manufacturing system
Application:
10/387,389 →
Publication:
US 2003/0164932