Security Agreement

Recorded: 2003-02-10 Received: 2003-02-10 Pages: 9

Assignor

VIASYSTEMS GROUP, INC.

Executed: 2003-01-31

Assignee

P.O. BOX 2558, HOUSTON, TX, 77252, UNITED STATES

Covered Properties (14)

Low-Contact Area Cutting Element

Application: 10/355,674 →

Process Parameter Event Monitoring System and Method for Process

Application: 10/282,771 →

Bending an Optical Fiber into a Backplane

Application: 10/179,756 →

Optical fiber right angle transition

Application: 10/179,757 →

System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications

Application: 10/179,758 →

Indoor-outdoor equipment enclosure and method for assemblying the same

Application: 60/382,839 →

Folded box section and manufacturing process for a corner post of a standard rack frame

Application: 60/369,215 →

Rack frame structure and method of assembling same

Application: 60/368,390 →

Preventing and/or treating cardiovascular disease and/or associated heart failure

Application: 60/364,382 →

Embedded waveguide and embedded electromagnetic shielding

Application: 10/046,323 →

Pcb Embedded and Surface Mounted Optical Distribution Systems

Application: 09/992,810 →

Fiber Optic Circuit Board Connector

Application: 10/051,418 →

HDI electrolytic plating system

Application: 60/344,417 →

Non-Circular Micro-Via

Application: 09/786,787 →