IP Library Granted Patent US 6,848,840
Granted Patent B2
US 6,848,840 · App. 10/051,418 · Granted Feb 1, 2005

Fiber optic circuit board connector

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Quick Facts
Patent No.
US 6,848,840
App. No.
10/051,418
Granted
Feb 1, 2005
Kind
B2
Abstract

An optical connector for use in multilayer electro-optic circuit boards. An electro-optical back plane circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.

Claims (17)

1. An optical connector for use with an electro-optical board, the optical connector comprising:

a right angle interface body having one or more first optical paths and one or more second optical paths, each of the first optical paths corresponding to a respective second optical path, wherein the first optical paths are disposed in a first plane and the one or more second optical paths are disposed in a second plane, the first and second optical planes being substantially at right angles with respect to one another;

a female self-alignment body having a tapered channel substantially aligned with the first plane; and

an anchor body adapted to securely engage an exterior surface of the female self-alignment body and adapted to anchor to a surface of the electro-optical board;

a tapered male self-alignment body sized to fit closely into the tapered channel of the female self-alignment body, and having one or more third optical paths adapted to align with the first optical paths when the tapered male self-alignment body is engaged with the female self-alignment body;

wherein the third optical paths are adapted for connection to one or more optical fibers disposed outside the electro-optical board, and

wherein the second optical paths are adapted for connection to optical fibers embedded in the electro-optical board.

2. An electro-optical back plane comprising:

a fiber management system formed of plural optical fibers;

an electrical bus circuit;

a board, wherein the fiber management system and the electrical bus circuit are embedded inside the board;

plural optical connectors disposed on the board, each of the plural optical connectors being coupled to one or more of the plural optical fibers of the fiber management system; and

plural electrical connectors disposed on the board, each of the electrical connectors being electrically connected to the electrical bus circuit;

wherein each of the optical connectors comprises:

a right angle interface body embedded into the board for connection to one or more fibers of the fiber management system;

an anchor body securely fastened to the surface of the board; and

a female self-alignment body having a tapered channel, wherein the female self-alignment body is held by the anchor body so that the tapered channel is in registration with an upper surface of the right angle interface body.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (035858/0890) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (063804/0702) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
PATENT SECURITY AGREEMENT (ABL) Recorded May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
MERGER Recorded May 12, 2023
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 063628/0122 →
MERGER Recorded May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
PATENT SECURITY AGREEMENT-ABL Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
RELEASE OF SECURITY INTEREST Recorded Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: VIASYSTEMS, INC.
Reel/Frame 035850/0669 →
PATENT SECURITY AGREEMENT-TERM Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
RELEASE OF SECURITY INTEREST Recorded Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
SECURITY AGREEMENT Recorded May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
SECURITY AGREEMENT Recorded Mar 10, 2010
From: VIASYSTEMS, INC.
To: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
Reel/Frame 024062/0634 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2010
From: VIASYSTEMS GROUP, INC.
To: VIASYSTEMS, INC.
Reel/Frame 023905/0147 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2010
From: TOURNE, JOSEPH A.A.M.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 023848/0023 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Aug 11, 2006
From: JPMORGAN CHASE BANK N.A.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 020186/0931 →