Patent Assignment
Reel/Frame 035851/0928
Patent Security Agreement-Term
Recorded: 2015-06-08
Pages: 12
Assignors
TTM TECHNOLOGIES, INC.
Executed: 2015-05-31
VIASYSTEMS, INC.
Executed: 2015-05-31
VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
Executed: 2015-05-31
Assignee
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
10 S. DEARBORN, 7TH FLOOR, CHICAGO, ILLINOIS, 60603
Covered Properties
(39)
Air-Dielectric Stripline
Patent:
5,712,607 →
Application:
08/631,580 →
Process for Manufacture of Printed Circuit Boards with Thick Copper Power Circuitry and Thin Copper Signal Circuitry on the Same Layer
Patent:
6,651,324 →
Application:
09/707,033 →
System and Method for Monitoring and Improving Dimensional Stability and Registration Accuracy of Multi-Layer Pcb Manufacture
Patent:
6,581,202 →
Application:
09/711,366 →
Pcb Embedded and Surface Mounted Optical Distribution Systems
Fiber Optic Circuit Board Connector
Bending an Optical Fiber into a Backplane
System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications
System and Method for Electrolytic Plating
Microelectronic Substrates with Thermally Conductive Pathways and Methods of Making Same
Method for Analyzing Material Density Variations on a Multi-Layer Printed Circuit Board
Bending an Optical Fiber into Backplane
Fiber Optic Circuit Connector
System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications
Fiber Optic Circuit Connector
Circuit Board Assembly Having a Guide Insert
Bending an Optical Fiber into a Backplane
Indoor-Outdoor Equipment Enclosure and Method for Assembling the Same
Bending an Optical Fiber into a Backplane
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Bending an Optical Fiber into a Backplane
Method of Manufacturing a Printed Circuit Board
Method of Manufacturing a Multilayer Printed Wiring Board with Copper Wrap Plated Hole
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
System for Filling Holes in a Printed Circuit Board with a Fluid Fill Material
System for Cleaning Components for Filling Holes in a Printed Circuit Board with a Fluid Fill Material
Manufacturing Methods of Multilayer Printed Circuit Board Having Stacked Via
Methods of Manufacturing Printed Circuit Boards
Patent:
8,020,292 →
Application:
12/772,086 →
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Methods of Manufacturing Printed Circuit Boards
Systems and Methods for Reducing Overhang on Electroplated Surfaces of Printed Circuit Boards
Methods of Manufacturing Printed Circuit Boards Using Parallel Processes to Interconnect with Subassemblies
Methods of Manufacturing a Printed Wiring Board Having Copper Wrap Plated Hole
Printed Circuit Board with Embedded Heater
Circuit Board Multi-Functional Hole System and Method
Method of Manufacturing a Printed Circuit Board
Application:
13/594,971 →
Publication:
US 2013/0220675
Method of Fabricating a Printed Circuit Board Interconnect Assembly
Systems and Methods of Manufacturing Printed Circuit Boards Using Blind and Internal Micro Vias to Couple Subassemblies
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Method for Anchoring a Conductive Cap on a Filled via in a Printed Circuit Board and Printed Circuit Board with an Anchored Conductive Cap
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest
Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
Reel/Frame 035857/0945 →
Release of Security Interest
Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: VIASYSTEMS, INC.
Reel/Frame 035850/0669 →
Release of Security Interest
Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
Release of Security Interest
Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: MERIX CORPORATION
Reel/Frame 035857/0333 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Supplement to Patent Security Agreement (Term Loan)
Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0829 →
Supplement to Patent Security Agreement (Abl)
Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0719 →
Merger
Sep 9, 2019
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 050313/0926 →
Merger
Sep 9, 2019
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 050313/0826 →
Merger
May 12, 2023
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 063628/0122 →
Merger
May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →