IP Library › Granted Patent US 9,913,382
Granted Patent B2
US 9,913,382 · App. 14/694,756 · Granted Mar 6, 2018

Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive cap

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Quick Facts
Patent No.
US 9,913,382
App. No.
14/694,756
Granted
Mar 6, 2018
Kind
B2
Abstract

The present invention relates to forming an anchored cap in a filled via in a PCB. The cap is formed by making an anchor opening in the filled via, depositing copper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion, so that the anchored cap is anchored to the filled via by the anchor portion. In another embodiment, the anchor portion and cap portion may be deposited in one step.

Claims (17)

1. An anchored cap on a filled via in a printed circuit board (PCB), the anchored cap comprising:

a conductive anchor portion extending into an anchor opening in the filled via to contact a plated conductive layer on a sidewall of the filled via; and

a conductive cap portion protruding above the surface of the PCB on top of the anchor portion.

2. The anchored cap of claim 1 , wherein the anchor portion in the filled via is 0.01 to 25 mils deep.

3. The anchored cap of claim 1 , wherein the anchor portion in the filled via is 1 to 10 mils deep.

4. The anchored cap of claim 1 , wherein the anchor opening has a diameter from 2 to 50 mils.

5. The anchored cap of claim 1 , wherein the anchor opening has a diameter from 4 to 20 mils.

6. A printed circuit board (PCB) comprising:

a substrate having a filled via, the filled via having an anchor opening;

a conductive anchor portion extending into the anchor opening in the filled via to contact a plated conductive layer on a sidewall of the filled via; and

a conductive cap portion protruding above the surface of the PCB on top of the anchor portion.

7. The PCB of claim 6 , wherein the anchor portion in the filled via is 0.01 to 25 mils deep.

8. The PCB of claim 6 , wherein the anchor portion in the filled via is 1 to 10 mils deep.

9. The PCB of claim 6 , wherein the anchor opening has a diameter from 2 to 50 mils.

10. The PCB of claim 6 , wherein the anchor opening has a diameter from 4 to 20 mils.

11. The anchored cap of claim 1 , wherein the anchored cap is in electrical contact with a conductive layer at the surface of the PCB.

12. The PCB of claim 6 , wherein the conductive cap is in electrical contact with a conductive layer at the surface of the PCB.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (063804/0702) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (035858/0890) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
PATENT SECURITY AGREEMENT (ABL) Recorded May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
CHANGE OF NAME Recorded Sep 9, 2019
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 050314/0305 →
PATENT SECURITY AGREEMENT-ABL Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
PATENT SECURITY AGREEMENT-TERM Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2015
From: SIDHU, RAJWANT; ZEPEDA, RUBEN
To: VIASYSTEMS TECHNOLOGIES CORP. L.L.C.
Reel/Frame 035714/0065 →