Patent Assignment
Reel/Frame 050314/0305
Change of Name
Recorded: 2019-09-09
Pages: 3
Assignor
VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
Executed: 2017-10-23
Assignee
TTM TECHNOLOGIES NORTH AMERICA, LLC
1665 SCENIC AVENUE, SUITE 250, COSTA MESA, CALIFORNIA, 92626
Covered Properties
(13)
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Method of Manufacturing a Printed Circuit Board
Method of Manufacturing a Multilayer Printed Wiring Board with Copper Wrap Plated Hole
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Manufacturing Methods of Multilayer Printed Circuit Board Having Stacked Via
Methods of Manufacturing Printed Circuit Boards
Patent:
8,020,292 →
Application:
12/772,086 →
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Methods of Manufacturing Printed Circuit Boards
Methods of Manufacturing Printed Circuit Boards Using Parallel Processes to Interconnect with Subassemblies
Methods of Manufacturing a Printed Wiring Board Having Copper Wrap Plated Hole
Printed Circuit Board with Embedded Heater
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Method for Anchoring a Conductive Cap on a Filled via in a Printed Circuit Board and Printed Circuit Board with an Anchored Conductive Cap
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →