Printed circuit board with embedded heater
View Patent ↗Aspects of the present invention are directed to providing a printed circuit board including a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a heater layer interposed between the top conductive layer and the bottom conductive layer and configured to generate and transfer heat to at least one of the electronic components.
1. A printed circuit board comprising:
a top conductive layer;
a bottom conductive layer;
a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer;
a plurality of heater layers interposed between the top conductive layer and the bottom conductive layer, wherein at least one heater layer of the plurality of heater layers is:
separate from and not disposed on or integrated into the top conductive layer or the bottom conductive layer;
configured to generate and transfer heat to at least one of the electronic components;
wherein the each heater layer of the plurality of heater layers comprises:
an input via;
an output via;
a substrate; and
a conductive pattern located on the substrate and configured to generate heat according to a driving signal, the conductive pattern being electrically coupled between the input via and the output via; and
wherein the plurality of heater layers comprises:
a horizontal heating layer comprising a horizontal conductive pattern, the horizontal conductive pattern comprising a plurality of conductive traces arranged in substantially parallel lines along a horizontal direction of the printed circuit board and electrically coupled in series between the input via and the output via of the horizontal heating layer by a plurality of connecting traces, a vertical heating layer comprising a vertical conductive pattern, the vertical conductive pattern comprising another plurality of conductive traces arranged in substantially parallel lines along a vertical direction of the printed circuit board and electrically coupled in series between the input via and the output via of the vertical heating layer by another plurality of connecting traces, and the horizontal heating layer and the vertical heating layer are arranged so that one of the horizontal heating layer or the vertical heating layer overlaps the other to form a heater grid.
2. The printed circuit board of claim 1 , wherein at least one of the electronic components has an operating temperature range, and the heater layer is configured to generate heat to raise the temperature of the at least one electronic component from a first temperature below the operating temperature range to a second temperature within the operating temperature range.
3. The printed circuit board of claim 2 , wherein the operating temperature range is from about −40 to about 85 degrees Celsius.
4. The printed circuit board of claim 1 further comprising:
a plurality of internal conductive layers for conducting signals when the printed circuit board is in operation, the internal conductive layers being interposed between the top conductive layer and the bottom conductive layer.
5. The printed circuit board of claim 4 , wherein:
at least one of the plurality of internal conductive layers comprises a solid conductor layer adjacent to the heating layer;
the solid conductor layer is coupled to a conductor pad on one of the top conductive layer or the bottom conductor layer; and
the solid conductor layer is configured to direct a thermal path to the conductor pad.
6. The printed circuit board of claim 4 , wherein:
the internal conductive layers are interposed between the heater layers and at least one of the top conductive layer and the bottom conductive layer, or
the heater layers are interposed between the internal conductive layers and at least one of the top conductive layer and the bottom conductive layer.
7. The printed circuit board of claim 1 , wherein:
the heater layer has a heating region and a non-heating region,
the conductive pattern is arranged in the heating region, each of the top conductive layer and the bottom conductive layer has a heated region,
each heated region corresponding to an area overlapping the heating region, and
the heater layer is configured to direct heat transfer to each of the heated regions.
8. The printed circuit board of claim 1 , wherein:
the conductive pattern has a high output section and a low output section,
the high output section has higher electrical resistance per unit length than the low output section,
the high output section is coupled in series with the low output section between the input via and the output via, and
the conductive pattern is configured to generate more heat in the high output section than in the low output section.
9. The printed circuit board of claim 1 , further comprising:
a plurality of conductive patterns on the substrate comprising the conductive pattern, wherein:
at least one of the conductive patterns is coupled in parallel with the other conductive patterns between the input via and the output via.
10. The printed circuit board of claim 1 further comprising:
a via coupling a conductive layer to another conductive layer, wherein the via is interposed between the heater and an electronic component of the electronic components for transferring heat generated by the heater layer to an area adjacent to the electronic component where the via is coupled to.
11. A system for heating a printed circuit board, the system comprising:
the printed circuit board comprising:
a top conductive layer; a bottom conductive layer;
a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer;
a plurality of heater layers interposed between the top conductive layer and the bottom conductive layer, wherein at least one particular heater layer of the plurality of heater layers is:
separate from and not disposed on or integrated into the top conductive layer or the bottom conductive layer; and
configured to generate and transfer heat to at least one of the electronic components;
wherein the at least one particular heater layer comprises:
an input via;
an output via;
a substrate; and
a conductive pattern located on the substrate and configured to generate heat according to a driving signal, the conductive pattern being electrically coupled between the input via and the output via; and
wherein the plurality of heater layers comprises:
a horizontal heating layer comprising a horizontal conductive pattern, the horizontal conductive pattern comprising a plurality of conductive traces arranged in substantially parallel lines along a horizontal direction of the printed circuit board and electrically coupled in series between the input via and the output via of the horizontal heating layer by a plurality of connecting traces, a vertical heating layer comprising a vertical conductive pattern, the vertical conductive pattern comprising another plurality of conductive traces arranged in substantially parallel lines along a vertical direction of the printed circuit board and electrically coupled in series between the input via and the output via of the vertical heating layer by another plurality of connecting traces, and the horizontal heating layer and the vertical heating layer are arranged so that one of the horizontal heating layer or the vertical heating layer overlaps the other to form a heater grid; and
a heater driver coupled to the printed circuit board.
12. The system of claim 11 , wherein the heater driver comprises:
a signal generator for generating a signal to drive the heater layer, and a controller for controlling the signal generator.
13. The system of claim 12 , wherein:
the signal generator is coupled to a conductive pattern in the heater layer;
the controller is coupled to a temperature sensor on the printed circuit board; and
the controller is configured to receive temperature data from the temperature sensor and to control the signal generator to output the signal according to the received temperature data.