Patent Assignment
Reel/Frame 075681/0922
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Recorded: 2026-06-02
Pages: 11
Assignor
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Executed: 2026-06-01
Assignees
TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.)
200 E. SANDPOINTE AVE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
200 E. SANDPOINTE AVE, SUITE 400, SANTA ANA, CALIFORNIA, 92707
Covered Properties
(39)
Method of Fabricating a Printed Circuit Board Interconnect Assembly
Method for Anchoring a Conductive Cap on a Filled via in a Printed Circuit Board and Printed Circuit Board with an Anchored Conductive Cap
Method of Manufacturing a Printed Circuit Board
Application:
13/594,971 →
Publication:
US US20130220675A1
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Systems and Methods of Manufacturing Printed Circuit Boards Using Blind and Internal Micro Vias to Couple Subassemblies
Circuit Board Multi-Functional Hole System and Method
Method for Analyzing Material Density Variations on a Multi-Layer Printed Circuit Board
System for Filling Holes in a Printed Circuit Board with a Fluid Fill Material
System for Cleaning Components for Filling Holes in a Printed Circuit Board with a Fluid Fill Material
Air-Dielectric Stripline
Patent:
5,712,607 →
Application:
08/631,580 →
Microelectronic Substrates with Thermally Conductive Pathways and Methods of Making Same
Manufacturing Methods of Multilayer Printed Circuit Board Having Stacked Via
Method of Manufacturing a Multilayer Printed Wiring Board with Copper Wrap Plated Hole
Methods of Manufacturing a Printed Wiring Board Having Copper Wrap Plated Hole
Method of Manufacturing a Printed Circuit Board
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Methods of Manufacturing Printed Circuit Boards
Methods of Manufacturing Printed Circuit Boards
Patent:
8,020,292 →
Application:
12/772,086 →
Methods of Manufacturing Printed Circuit Boards Using Parallel Processes to Interconnect with Subassemblies
Printed Circuit Board with Embedded Heater
Systems and Methods for Reducing Overhang on Electroplated Surfaces of Printed Circuit Boards
Bending an Optical Fiber into a Backplane
Bending an Optical Fiber into Backplane
Bending an Optical Fiber into a Backplane
Bending an Optical Fiber into a Backplane
Bending an Optical Fiber into a Backplane
Circuit Board Assembly Having a Guide Insert
Fiber Optic Circuit Board Connector
Fiber Optic Circuit Connector
Fiber Optic Circuit Connector
System and Method for Electrolytic Plating
Indoor-Outdoor Equipment Enclosure and Method for Assembling the Same
Pcb Embedded and Surface Mounted Optical Distribution Systems
Process for Manufacture of Printed Circuit Boards with Thick Copper Power Circuitry and Thin Copper Signal Circuitry on the Same Layer
Patent:
6,651,324 →
Application:
09/707,033 →
System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications
System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications
System and Method for Monitoring and Improving Dimensional Stability and Registration Accuracy of Multi-Layer Pcb Manufacture
Patent:
6,581,202 →
Application:
09/711,366 →
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 15, 2016
From: VESCE, JOHN; HEERY, JOSEPH WILLIAM, JR.
To: TTM TECHNOLOGIES INC.
Reel/Frame 040637/0715 →
Change of Name
Sep 9, 2019
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 050314/0305 →
Merger
Sep 9, 2019
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 050313/0926 →
Merger
May 12, 2023
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 063628/0122 →
Merger
May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
Change of Name
May 12, 2023
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, INC.
Reel/Frame 063635/0226 →
Corrective Assignment to Correct the the Name of the Assignee Previously Recorded at Reel: 040637 Frame: 0715. Assignor(S) Hereby Confirms the Assignment.
May 22, 2023
From: VESCE, JOHN; HEERY, JOSEPH WILLIAM, JR.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063722/0874 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Change of Name
May 26, 2026
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075627/0337 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →