Patent Assignment
Reel/Frame 063628/0122
Merger
Recorded: 2023-05-12
Pages: 3
Assignor
VIASYSTEMS, INC.
Executed: 2017-10-27
Assignee
VIASYSTEMS GROUP, INC.
1665 SCENIC AVENUE, SUITE 250, COSTA MESA, CALIFORNIA, 92626
Covered Properties
(18)
Process for Manufacture of Printed Circuit Boards with Thick Copper Power Circuitry and Thin Copper Signal Circuitry on the Same Layer
Patent:
6,651,324 →
Application:
09/707,033 →
System and Method for Monitoring and Improving Dimensional Stability and Registration Accuracy of Multi-Layer Pcb Manufacture
Patent:
6,581,202 →
Application:
09/711,366 →
Pcb Embedded and Surface Mounted Optical Distribution Systems
Fiber Optic Circuit Board Connector
Bending an Optical Fiber into a Backplane
System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications
System and Method for Electrolytic Plating
Indoor-Outdoor Equipment Enclosure and Method for Assembling the Same
Bending an Optical Fiber into Backplane
Fiber Optic Circuit Connector
System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications
Fiber Optic Circuit Connector
Circuit Board Assembly Having a Guide Insert
Bending an Optical Fiber into a Backplane
Indoor-Outdoor Equipment Enclosure and Method for Assembling the Same
Bending an Optical Fiber into a Backplane
Bending an Optical Fiber into a Backplane
Circuit Board Multi-Functional Hole System and Method
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Supplement to Patent Security Agreement (Term Loan)
Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0829 →
Supplement to Patent Security Agreement (Abl)
Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0719 →
Merger
Sep 9, 2019
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 050313/0926 →
Merger
Sep 9, 2019
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 050313/0826 →
Merger
May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →