Patent Assignment
Reel/Frame 049391/0719
Supplement to Patent Security Agreement (Abl)
Recorded: 2019-06-06
Pages: 7
Assignors
TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.)
Executed: 2019-06-03
TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
Executed: 2019-06-03
Assignee
JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
10 S. DEARBORN, 7TH FLOOR, CHICAGO, ILLINOIS, 60603
Covered Properties
(2)
Polymer Melting and Extrruding Apparatus with Linear Downstream Threads
Patent:
6,454,454 →
Application:
09/614,180 →
Fiber Optic Circuit Connector
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 5, 2010
From: VIASYSTEMS GROUP, INC.
To: VIASYSTEMS, INC.
Reel/Frame 023905/0147 →
Security Agreement
May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Release of Security Interest
Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: VIASYSTEMS, INC.
Reel/Frame 035850/0669 →
Release of Security Interest
Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Supplement to Patent Security Agreement (Term Loan)
Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0829 →
Merger
Sep 9, 2019
From: TTM ADVANCED CIRCUITS, INC.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 050801/0122 →
Merger
May 12, 2023
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 063628/0122 →
Merger
May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →