IP Library Granted Patent US 6,976,793
Granted Patent B2
US 6,976,793 · App. 10/825,980 · Granted Dec 20, 2005

Fiber optic circuit connector

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Quick Facts
Patent No.
US 6,976,793
App. No.
10/825,980
Granted
Dec 20, 2005
Kind
B2
Abstract

An optical connector for use in multilayer electro-optic circuit boards. An electro-optical back plane circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.

Claims (37)

1. A method of forming an optical connector, comprising:

connecting a right angle interface body to a set of one or more optical fibers, the right angle interface body having one or more first optical paths and one or more second optical paths, each of the first optical paths being optically connected to a corresponding second optical path, wherein the first optical paths are disposed in a first plane and the one or more second optical paths are disposed in a second plane, the first and the second planes being substantially at right angles with respect to one another;

embedding the right angle interface body and the one or more optical fibers inside an electro-optical board; and

forming a hole in the electro-optical board to expose a portion of the right angle interface body and thereby permit a set of one or more optical fibers disposed outside the elector-optical board to be optically connected to the first optical paths of the right angle interface body.

2. The method of claim 1 further comprising:

providing a protective covering on the right angle interface body to cover the first optical paths prior to embedding the right angle interface body inside the electro-optical board; and

removing the protective covering from the right angle interface body after forming the hole in the electro-optical board.

3. The method of claim 1 further comprising the step of connecting the right angle interface body to a registration plate prior to embedding the right angle interface body.

4. The method of claim 1 wherein the right angle interface body has a plurality of anchor members extending downwardly from a bottom side thereof, and wherein the step of connecting the right angle interface body to the registration plate further comprises inserting the anchor member of the right angle interface body into alignment holes provided in the registration plate.

5. The method of claim 1 further comprising:

securing a female body having a channel formed therethrough to the electro-optical board with the channel of the female body substantially aligned with the first optical paths of the right angle interface body.

6. The method of claim 1 wherein the right angle interface body has a tapered sidewall, and wherein the step of forming a hole in the electro-optical board to expose the right angle interface body further comprises exposing at least a portion of the tapered sidewall of the right angle interface body.

7. The method of claim 6 further comprising:

securing a female body having a channel to the electro-optical board with the female body in registration with the tapered sidewall of the right angle interface body and the channel substantially aligned with the first optical paths of the right angle interface body.

8. The method of claim 1 further comprising:

securing an anchor body about the hole of the electro-optical board;

inserting a female body having a channel through the anchor body and into the hole of the electro-optical board so that the channel of the female body is substantially aligned with the first optical paths of the right angle interface body; and

securing the female body to the anchor body.

9. The method of claim 8 wherein the right angle interface body has a tapered sidewall, wherein the step of forming a hole in the electro-optical board to expose an upper surface of the embedded right angle interface body further comprises exposing at least a portion of the tapered sidewall of the right angle interface body, and wherein the step of securing the female body to the anchor body further comprises:

securing the female body to the anchor body with the female body in registration with the tapered sidewall of the right angle interface body.

10. A method of forming an optical connector, comprising:

connecting a right angle interface body to a set of one or more optical fibers, the right angle interface body having one or more first optical paths and one or more second optical paths, each of the first optical paths being optically connected to a corresponding second optical path, wherein the first optical paths are disposed in a first plane and the one or more second optical paths are disposed in a second plane, the first and the second planes being substantially at right angles with respect to one another;

connecting the right angle interface body to a registration plate;

embedding the right angle interface body and the one or more optical fibers inside an electro-optical board;

forming a hole in the electro-optical board to expose a portion of the right angle interface body; and

securing a female body having a channel formed therethrough to the electro-optical board with the channel substantially aligned with the first optical paths of the right angle interface body to permit a set of one or more optical fibers disposed outside the elector-optical board to be optically connected to the first optical paths of the right angle interface body.

11. The method of claim 10 further comprising:

providing a protective covering on the right angle interface body to cover the first optical paths prior to embedding the right angle interface body inside the electro-optical board; and

removing the protective covering from the right angle interface body after forming the hole in the electro-optical board.

12. The method of claim 10 wherein the right angle interface body has a plurality of anchor members extending downwardly from a bottom side thereof, and wherein the step of connecting the right angle interface body to the registration plate further comprises inserting the anchor member of the right angle interface body into alignment holes provided in the registration plate.

13. The method of claim 10 wherein the right angle interface body has a tapered sidewall, and wherein the step of forming a hole in the electro-optical board to expose the right angle interface body further comprises exposing at least a portion of the tapered sidewall of the right angle interface body.

14. The method of claim 13 further comprising:

securing the female body to the electro-optical board with the female body in registration with the tapered sidewall of the right angle interface body.

15. The method of claim 10 further comprising:

securing an anchor body about the hole of the electro-optical board;

inserting the female body through the anchor body and into the hole of the electro-optical board; and

securing the female body to the anchor body.

Assignments (16)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (063804/0702) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (035858/0890) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
PATENT SECURITY AGREEMENT (ABL) Recorded May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
MERGER Recorded May 12, 2023
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 063628/0122 →
MERGER Recorded May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0719 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0829 →
RELEASE OF SECURITY INTEREST Recorded Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
PATENT SECURITY AGREEMENT-ABL Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
RELEASE OF SECURITY INTEREST Recorded Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: VIASYSTEMS, INC.
Reel/Frame 035850/0669 →
PATENT SECURITY AGREEMENT-TERM Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
SECURITY AGREEMENT Recorded May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
SECURITY AGREEMENT Recorded Mar 10, 2010
From: VIASYSTEMS, INC.
To: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
Reel/Frame 024062/0634 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2010
From: VIASYSTEMS GROUP, INC.
To: VIASYSTEMS, INC.
Reel/Frame 023905/0147 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2005
From: TOURNE, JOSEPH A.A.M.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 015607/0737 →