Patent Assignment
Reel/Frame 023905/0147
Assignment of Assignor's Interest
Recorded: 2010-02-05
Received: 2010-02-05
Pages: 7
Assignor
VIASYSTEMS GROUP, INC.
Executed: 2010-02-05
Assignee
VIASYSTEMS, INC.
101 S. HANLEY ROAD, SUITE 400, ST. LOUIS, MO, 63105, UNITED STATES
Covered Properties
(20)
Bending an Optical Fiber into a Backplane
Application:
11/714,756 →
Closed Loop Backdrilling System
Application:
11/506,725 →
Bending an Optical Fiber into a Backplane
Application:
11/501,613 →
Indoor-Outdoor Equipment Enclosure and Method for Assembling the Same
Application:
11/500,106 →
Bending an Optical Fiber into a Backplane
Application:
11/348,923 →
Circuit Board Assembly Having a Guide Insert
Application:
11/345,858 →
Fiber Optic Circuit Connector
Application:
11/311,616 →
Rack Frame Structure and Method of Assembling Same
Application:
11/299,614 →
System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications
Application:
11/016,146 →
Closed Loop Backdrilling System
Application:
10/944,583 →
Method for Manufacturing a Sequential Backplane
Application:
10/887,484 →
Fiber Optic Circuit Connector
Application:
10/825,980 →
Bending an Optical Fiber into Backplane
Application:
10/618,786 →
Indoor-Outdoor Equipment Enclosure and Method for Assembling the Same
Application:
10/444,665 →
System and Method for Electrolytic Plating
Application:
10/273,820 →
Bending an Optical Fiber into a Backplane
Application:
10/179,756 →
System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications
Application:
10/179,758 →
Pcb Embedded and Surface Mounted Optical Distribution Systems
Application:
09/992,810 →
Fiber Optic Circuit Board Connector
Application:
10/051,418 →
Non-Circular Micro-Via
Application:
09/786,787 →