IP Library Granted Patent US 7,095,939
Granted Patent B2
US 7,095,939 · App. 11/348,923 · Granted Aug 22, 2006

Bending an optical fiber into a backplane

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Quick Facts
Patent No.
US 7,095,939
App. No.
11/348,923
Granted
Aug 22, 2006
Kind
B2
Abstract

A right angle bend mount for bending an optical fiber into the plane of a circuit board. The mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.

Claims (22)

1. An electro-optical assembly, comprising:

a bend mount comprising:

a base having two clamp surfaces;

a cover having two clamp surfaces, the cover being pivotally connected to the base such that the base and the cover are movable to a closed position;

a first clamp formed by opposed clamp surfaces of the base and the cover when the base and the cover are in the closed position; and

a second clamp formed by opposed clamp surfaces of the base and the cover when the base and the cover are the closed position;

an optical fiber having a ferrule portion and a non-ferrule portion, the optical fiber positioned between the base and the cover with the ferrule portion of the optical fiber gripped by the first clamp and the non-ferrule portion gripped by the second clamp such that the ferrule portion is held at a non-zero angle to the gripped non-ferrule portion when the base and the cover are in the closed position; and

a backplane defining an opening, at least a portion of the bend mount positioned within the opening in the backplane.

2. The electro-optical assembly of claim 1 , wherein a bent portion of the optical fiber is disposed in a non-gripping gap between the base and the cover when the base and the cover are the closed position.

3. The electro-optical assembly of claim 1 , wherein the cover is pivotally connected to the base adjacent the first clamp.

4. The electro-optical assembly of claim 1 , wherein the base and the cover are formed as a single piece.

5. An electro-optical assembly, comprising:

a bend mount comprising:

a base having two clamp surfaces joined by an integral right angled portion;

a cover having two clamp surfaces joined by an integral right angled portion;

a first clamp formed by opposed clamp surfaces of the base and the cover when the base and the cover are in the closed position; and

a second clamp formed by opposed clamp surfaces of the base and the cover when the base and the cover are the closed position;

an optical fiber having a ferrule portion and a non-ferrule portion, the optical fiber positioned between the base and the cover with the ferrule portion of the optical fiber gripped by the first clamp and the non-ferrule portion gripped by the second clamp such that the ferrule portion is held at a right angle to the gripped non-ferrule portion when the base and the cover are in the closed position; and

a backplane defining an opening, at least a portion of the bend mount positioned within the opening in the backplane.

6. The electro-optical assembly of claim 5 , wherein a bent portion of the optical fiber is disposed in a non-gripping gap between the base and the cover when the base and the cover are in the closed position.

7. The electro-optical assembly of claim 5 , wherein the cover is pivotally connected to the base adjacent the first clamp.

8. The electro-optical assembly of claim 5 , wherein the base and the cover are formed as a single piece.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (035858/0890) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
MERGER Recorded May 12, 2023
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 063628/0122 →
MERGER Recorded May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
PATENT SECURITY AGREEMENT-ABL Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
RELEASE OF SECURITY INTEREST Recorded Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
RELEASE OF SECURITY INTEREST Recorded Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: VIASYSTEMS, INC.
Reel/Frame 035850/0669 →
PATENT SECURITY AGREEMENT-TERM Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
SECURITY AGREEMENT Recorded May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
SECURITY AGREEMENT Recorded Mar 10, 2010
From: VIASYSTEMS, INC.
To: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
Reel/Frame 024062/0634 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2010
From: VIASYSTEMS GROUP, INC.
To: VIASYSTEMS, INC.
Reel/Frame 023905/0147 →