Patent Assignment
Reel/Frame 035850/0669
Release of Security Interest
Recorded: 2015-06-08
Pages: 8
Assignor
WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
Executed: 2015-06-01
Assignee
VIASYSTEMS, INC.
101 SOUTH HANLEY ROAD, SUITE 1800, ST. LOUIS, MISSOURI, 63105
Covered Properties
(23)
Process for Manufacture of Printed Circuit Boards with Thick Copper Power Circuitry and Thin Copper Signal Circuitry on the Same Layer
Patent:
6,651,324 →
Application:
09/707,033 →
System and Method for Monitoring and Improving Dimensional Stability and Registration Accuracy of Multi-Layer Pcb Manufacture
Patent:
6,581,202 →
Application:
09/711,366 →
Non-Circular Micro-Via
Patent:
6,713,685 →
Application:
09/786,787 →
Via Connector and Method of Making Same
Pcb Embedded and Surface Mounted Optical Distribution Systems
Fiber Optic Circuit Board Connector
Bending an Optical Fiber into a Backplane
System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications
System and Method for Electrolytic Plating
Indoor-Outdoor Equipment Enclosure and Method for Assembling the Same
Bending an Optical Fiber into Backplane
Fiber Optic Circuit Connector
Method for Manufacturing a Sequential Backplane
Closed Loop Backdrilling System
System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications
Rack Frame Structure and Method of Assembling Same
Fiber Optic Circuit Connector
Circuit Board Assembly Having a Guide Insert
Bending an Optical Fiber into a Backplane
Indoor-Outdoor Equipment Enclosure and Method for Assembling the Same
Bending an Optical Fiber into a Backplane
Closed Loop Backdrilling System
Application:
11/506,725 →
Publication:
US 2006/0278429
Bending an Optical Fiber into a Backplane
Related Assignments
(16)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest
May 3, 2012
From: WILMINGTON TRUST, NATIONAL ASSOCIATION (SUCCESSOR BY MERGER TO WILMINGTON TRUST FSB), AS COLLATERAL TRUSTEE
To: VIASYSTEMS, INC.
Reel/Frame 028151/0326 →
Security Agreement
May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Release of Security Interest
Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
Reel/Frame 035857/0945 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Release of Security Interest
Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
Supplement to Patent Security Agreement (Abl)
Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0719 →
Supplement to Patent Security Agreement (Term Loan)
Jun 6, 2019
From: TTM TECHNOLOGIES, INC. (F/K/A VIASYSTEMS GROUP, INC., F/K/A VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (F/K/A TTM ADVANCED CIRCUITS, INC.)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049391/0829 →
Merger
Sep 9, 2019
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 050313/0826 →
Merger
Sep 9, 2019
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 050313/0926 →
Merger
May 12, 2023
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 063628/0122 →
Merger
May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →