IP Library Granted Patent US 7,187,839
Granted Patent B2
US 7,187,839 · App. 11/501,613 · Granted Mar 6, 2007

Bending an optical fiber into a backplane

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Quick Facts
Patent No.
US 7,187,839
App. No.
11/501,613
Granted
Mar 6, 2007
Kind
B2
Abstract

A method of connecting an optical fiber to a backplane with a right angle bend mount. The bend mount includes a base and a cover that is pivotably connected to the base by a hinge. A clamp is formed by a first pair of opposed surfaces of the base and cover adjacent the hinge. This clamp fixedly grips a ferrule portion of the optical fiber when the base and the cover are closed together. A second pair of opposed surfaces of the base and cover forms another clamp. This clamp fixedly grips a non-ferrule portion of the optical fiber when the base and the cover are closed together. A bent portion of the optical fiber between the ferrule portion and the gripped non-ferrule portion is disposed in a non-gripping gap between the base and the cover when the base and the cover are closed together.

Claims (14)

1. A method of connecting an optical fiber to a backplane having an opening, the optical fiber having a ferrule portion and a non-ferrule portion, the method comprising:

providing a bend mount having a base with two clamp surfaces and a cover pivotally connected to the base and having two clamp surfaces;

positioning the optical fiber between the base and the cover;

moving the base and the cover to a closed position to grip the ferrule portion of the optical fiber between a first pair of opposed clamp surfaces of the base and the cover and to grip the non-ferrule portion of the optical fiber between a second pair of opposed clamp surfaces of the base and the cover such that the ferrule portion is held at a non-zero angle to the gripped non-ferrule portion; and

positioning at least a portion of the bend mount within the opening of the backplane.

2. The method of claim 1 wherein a bent portion of the optical fiber is disposed in a non-gripping gap between the base and the cover when the base and the cover are the closed position.

3. The method of claim 1 wherein in the step of providing the bend mount, the base and the cover are formed as a single piece.

4. A method of connecting an optical fiber to a backplane having an opening, the optical fiber having a ferrule portion and a non-ferrule portion, the method comprising:

providing a bend mount having a base with two clamp surfaces joined by an integral right angled portion and a cover connected to the base and having two clamp surfaces joined by an integral right angled portion;

positioning the optical fiber between the base and the cover;

moving the base and the cover to a closed position to grip the ferrule portion of the optical fiber between a first pair of opposed clamp surfaces of the base and the cover and to grip the non-ferrule portion of the optical fiber between a second pair of opposed clamp surfaces of the base and the cover such that the ferrule portion is held at a right angle to the gripped non-ferrule portion; and

positioning at least a portion of the bend mount within the opening of the backplane.

5. The method of claim 4 , wherein a bent portion of the optical fiber is disposed in a non-gripping gap between the base and the cover when the base and the cover are the closed position.

6. The method of claim 4 wherein in the step of providing the bend mount, the base and the cover are formed as a single piece.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (035858/0890) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
MERGER Recorded May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
MERGER Recorded May 12, 2023
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 063628/0122 →
PATENT SECURITY AGREEMENT-ABL Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
RELEASE OF SECURITY INTEREST Recorded Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: VIASYSTEMS, INC.
Reel/Frame 035850/0669 →
PATENT SECURITY AGREEMENT-TERM Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
RELEASE OF SECURITY INTEREST Recorded Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →