IP Library Granted Patent US 7,178,994
Granted Patent B2
US 7,178,994 · App. 11/311,616 · Granted Feb 20, 2007

Fiber optic circuit connector

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,178,994
App. No.
11/311,616
Granted
Feb 20, 2007
Kind
B2
Abstract

A circuit board uses both electrical and optical connectors to carry signals in both electrical and light form. The optical connector employs redundant alignment features to provide for reliable connectivity between plug in boards and the electro-optic back plane. A process is of forming the back plane and other multilevel circuit boards so as to embed optical connectors is disclosed.

Claims (8)

1. A circuit board, comprising:

a plurality of layers;

an optical fiber embedded within the layers;

a right angle interface body connected to the optical fiber and embedded within the layers, the right angle interface body has one or more first optical paths and one or more second optical paths, each of the first optical paths being optically coupled to a corresponding second optical path, wherein the first optical paths are disposed in a first plane and the one or more second optical paths are disposed in a second plane, the first and second planes being at substantially a right angle with respect to one another; and a registration plate having at least one alignment hole, and wherein the right angle interface body further comprises at least one anchor member extending downwardly from a bottom side of the right angle interface body and received in the alignment hole of the registration plate.

2. The circuit board of claim 1 , further comprising a protective covering on a top surface of the right angle interface body covering the first optical paths.

3. The circuit board of claim 2 , wherein the protective covering is a copper tape.

4. The circuit board of claim 1 , further comprising an outer copper foil layered on as a top layer.

5. The circuit board of claim 1 , wherein the right angle interface body has a tapered sidewall.

Assignments (11)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (035858/0890) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
MERGER Recorded May 12, 2023
From: VIASYSTEMS, INC.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 063628/0122 →
MERGER Recorded May 12, 2023
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 063629/0313 →
PATENT SECURITY AGREEMENT-ABL Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
RELEASE OF SECURITY INTEREST Recorded Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
RELEASE OF SECURITY INTEREST Recorded Jun 8, 2015
From: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
To: VIASYSTEMS, INC.
Reel/Frame 035850/0669 →
PATENT SECURITY AGREEMENT-TERM Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
SECURITY AGREEMENT Recorded May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
SECURITY AGREEMENT Recorded Mar 10, 2010
From: VIASYSTEMS, INC.
To: WACHOVIA CAPITAL FINANCE CORPORATION (NEW ENGLAND)
Reel/Frame 024062/0634 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2010
From: VIASYSTEMS GROUP, INC.
To: VIASYSTEMS, INC.
Reel/Frame 023905/0147 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2010
From: TOURNE, JOSEPH A.A.M.
To: VIASYSTEMS GROUP, INC.
Reel/Frame 023848/0023 →