IP Library Granted Patent US 8,444,770
Granted Patent B2
US 8,444,770 · App. 12/494,240 · Granted May 21, 2013

System for cleaning components for filling holes in a printed circuit board with a fluid fill material

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Quick Facts
Patent No.
US 8,444,770
App. No.
12/494,240
Granted
May 21, 2013
Kind
B2
Abstract

A method for cleaning components of a system for filling holes in a printed circuit board with a fluid fill material includes removing the components being a dispensing head and a manifold connected to the dispensing head preferably as a single unit. The single unit is retained in that format. Excess fluid material from the dispensing head and manifold is evacuated preferably by passing air through the dispensing head and manifold. Then the dispensing head and manifold is placed in a cleaning tub, and the manifold is attached to a solvent pump line. The dispensing head and manifold is flushed with a flow of solvent from the solvent pump line; and excess solvent from the dispensing head and manifold is evacuated, by passing air through the dispensing head and manifold.

Claims (45)

1. A method for cleaning components of a system for filling holes in a printed circuit board with a fluid fill material, the method comprising the steps of:

removing the components being a dispensing head and a manifold connected to the dispensing head, the removal being to separate the components from the filling system;

coupling a supply line for air to the manifold and placing the dispensing head and manifold in a first container;

firstly evacuating excess fill material from the dispensing head and manifold by passing air through the dispensing head and manifold while in the first container;

placing the dispensing head and manifold in a cleaning tub, the cleaning tub being different to the first container;

attaching the manifold to a solvent pump line through a nipple attached to the cleaning tub;

secondly flushing the dispensing head and manifold with a flow of solvent from the solvent pump line;

removing the manifold and dispensing head from the cleaning tub;

re-coupling the supply line for air to the manifold and re-locating the dispensing head and manifold in the first container; and

thirdly evacuating excess solvent from the dispensing head and manifold by passing air through the dispensing head and manifold.

2. The method as claimed in claim 1 wherein the manifold includes a single channel splitting at a junction into two channels, the two channels being connected at their respective opposite ends to the dispensing head.

3. The method as claimed in claim 2 wherein a connection with the dispensing head is at a location towards the respective ends of the dispensing head.

4. The method as claimed in claim 1 wherein the manifold is connected to the solvent pump line and includes channels and connectors to the dispensing head, the channels and connectors having different branches, and wherein the channels include a first channel, branching to two secondary channels, and wherein each secondary channel branches in turn to two tertiary channels, and wherein the four tertiary channels are attached to the dispensing head, and wherein at least some of the junctions between adjacent channels are formed in a non-right-angular relationship with adjacent channels.

5. The method as claimed in claim 4 wherein the manifold comprises a center block and a plurality of side blocks having channels within, the center block being connected to the solvent pump line, and wherein a first channel branches to two secondary channels within the center block, each secondary channel being connected to a side block and branching in turn to two tertiary channels within the side block, the four tertiary channels being connected to the dispensing head, and wherein at least some of the junctions between adjacent channels are formed in the absence of a right-angular relationship with adjacent channels.

6. The method as claimed in claim 1 wherein an outlet system includes a flow path having the solvent pump line attached to a manifold leading to the dispensing head, the manifold including connectors between the channels and with the absence of 90° elbows in the flow path.

7. A method for cleaning components of a system for filling holes in a printed circuit board with a fluid fill material, the method comprising the steps of:

removing the components being a dispensing head and a manifold connected to the dispensing head as a single unit, the removal being to separate the components from the filling system;

coupling a supply line for air to the manifold and placing the dispensing head and manifold;

firstly evacuating excess fill material from the dispensing head and manifold by passing air through the dispensing head and manifold;

placing the dispensing head and manifold in a cleaning tub;

attaching the manifold to a solvent pump line through a nipple attached to the cleaning tub;

secondly flushing the dispensing head and manifold with a flow of solvent from the solvent pump line;

removing the manifold and dispensing head from the cleaning tub;

re-coupling the supply line for air to the manifold; and

thirdly evacuating excess solvent from the dispensing head and manifold by passing air through the dispensing head and manifold.

8. The method as claimed in claim 7 wherein the manifold includes a single tube splitting at a junction into two tubes, the two tubes being connected at their respective opposite ends to the dispensing head.

9. The method as claimed in claim 8 wherein a connection with the dispensing head is at a location towards the respective ends of the dispensing head.

10. The method as claimed in claim 7 wherein the manifold is connected to the solvent pump line and includes channels and connectors to the dispensing head, the channels and connectors having different branches, and wherein the channels include a first channel, branching to two secondary channels, and wherein each secondary channel branches in turn to two tertiary channels, and wherein the four tertiary channels are attached to the dispensing head, and wherein at least some of the junctions between adjacent channels are formed in a non-right-angular relationship with adjacent channels.

11. The method as claimed in claim 10 wherein the manifold comprises a center block and a plurality of side blocks having channels within, the center block being connected to the solvent pump line, and wherein a first channel branches to two secondary channels within the center block, each secondary channel being connected to a side block and branching in turn to two tertiary channels within the side block, the four tertiary channels being connected to the dispensing head, and wherein at least some of the junctions between adjacent channels are formed in the absence of a right-angular relationship with adjacent channels.

12. The method as claimed in claim 7 wherein an outlet system includes a flow path having the solvent pump line attached to a manifold leading to the dispensing head, the manifold including connectors between the channels and with the absence of 90° elbows in the flow path.

13. A method for cleaning components of a system for filling holes in a printed circuit board with a fluid fill material, the method comprising the steps of:

removing the components being a dispensing head and a manifold connected to the dispensing head as a single unit; the removal being to separate the components from the filling system;

coupling a supply line for air to the manifold and placing the dispensing head and manifold in a first container;

firstly evacuating excess fill material from the dispensing head and manifold by passing air through the dispensing head and manifold while in the first container;

placing the dispensing head and manifold in a cleaning tub;

attaching the manifold to a solvent pump line through a nipple attached to the cleaning tub;

secondly flushing the dispensing head and manifold with a flow of solvent from the solvent pump line;

removing the manifold and dispensing head from the cleaning tub;

re-coupling the supply line for air to the manifold and re-locating the dispensing head and manifold in the first container; and

thirdly evacuating excess solvent from the dispensing head and manifold.

14. The method as claimed in claim 13 wherein the manifold includes a single tube splitting at a junction into two tubes, the two tubes being connected at their respective opposite ends to the dispensing head.

15. The method as claimed in claim 14 wherein a connection with the dispensing head is at a location towards the respective ends of the dispensing head.

16. The method as claimed in claim 3 wherein the manifold is connected to the solvent pump line and includes channels and connectors to the dispensing head, the channels and connectors having different branches, and wherein the channels include a first channel, branching to two secondary channels, and wherein each secondary channel branches in turn to two tertiary channels, and wherein the four tertiary channels are attached to the dispensing head, and wherein at least some of the junctions between adjacent channels are formed in a non-right-angular relationship with adjacent channels.

17. The method as claimed in claim 16 wherein the manifold comprises a center block and a plurality of side blocks having channels within, the center block being connected to the solvent pump line, and wherein a first channel branches to two secondary channels within the center block, each secondary channel being connected to a side block and branching in turn to two tertiary channels within the side block, the four tertiary channels being connected to the dispensing head, and wherein at least some of the junctions between adjacent channels are formed in the absence of a right-angular relationship with adjacent channels.

18. The method as claimed in claim 13 wherein an outlet system includes a flow path having the solvent pump line attached to a manifold leading to the dispensing head, the manifold including connectors between the channels and with the absence of 90° elbows in the flow path.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (035858/0890) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (063804/0702) Recorded Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
PATENT SECURITY AGREEMENT (ABL) Recorded May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
PATENT SECURITY AGREEMENT-ABL Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
PATENT SECURITY AGREEMENT-TERM Recorded Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2009
From: HOHLFELDER, TADD; MORAN, BRAD; MATTHEWS, RUBIN; GANNON, THOMAS
To: TTM TECHNOLOGIES, INC.
Reel/Frame 022889/0715 →