IP Library Assignment 022889/0715
Patent Assignment
Reel/Frame 022889/0715

Assignment of Assignor's Interest

Recorded: 2009-06-29 Pages: 5
Assignors
HOHLFELDER, TADD
Executed: 2009-06-29
MORAN, BRAD
Executed: 2009-06-26
MATTHEWS, RUBIN
Executed: 2009-06-26
GANNON, THOMAS
Executed: 2009-06-29
Assignee
TTM TECHNOLOGIES, INC.
2630 SOUTH HARBOR BOULEVARD, SANTA ANA, CALIFORNIA, 92704
Covered Property (1)
System for Cleaning Components for Filling Holes in a Printed Circuit Board with a Fluid Fill Material
Patent: 8,444,770 →
Application: 12/494,240 →
Publication: US 2010/0326473
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement-Term Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Patent Security Agreement-Abl Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Patent Security Agreement (Abl) May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan) May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702) Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890) Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →