Methods of manufacturing printed circuit boards with stacked micro vias
View Patent ↗A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.
1. A method of manufacturing at least a portion of a printed circuit board, the method comprising:
imaging at least one photo resist onto a first plural-layer substrate having a metal foil formed on a first side of the first plural-layer substrate;
etching off the metal foil from the first plural-layer substrate with exception of at least one part of the metal foil covered by the at least one photo resist;
stripping off the at least one photo resist to expose the at least one part of the metal foil to form at least one first metal pad on the first side of the first plural-layer substrate;
providing a lamination adhesive and a protective film;
forming at least one via into the protective film and the lamination adhesive to expose the at least one first metal pad on the first side of the first plural-layer substrate comprising a plurality of first circuit layers;
filling at least one conductive paste into the via formed in the lamination adhesive and the protective film;
removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and
linking the first plural-layer substrate with a second plural-layer substrate comprising a plurality of second circuit layer with at least one second metal pad on a second side of the second plural-layer substrate.
2. The method of claim 1 , wherein the providing of the lamination adhesive and the protective film comprises:
applying the lamination adhesive and the protective film on the first plural-layer substrate comprising the plurality of first circuit layers with the at least one first metal pad on the first side of the first plural-layer substrate, the lamination adhesive being between the protective film and the first plural-layer substrate.
3. The method of claim 1 , wherein the linking of the first plural-layer substrate with the second plural-layer substrate comprises: aligning the first plural-layer substrate with the second plural-layer substrate; and curing the lamination adhesive between the first plural-layer substrate and the second plural-layer substrate to laminate the first and second plural-layer substrates with each other.
4. The method of claim 1 , wherein the at least one via has a diameter between about 0.004″ and about 0.010″.