Patent Assignment
Reel/Frame 031863/0129
Change of Name
Recorded: 2013-12-31
Pages: 8
Assignor
DDI GLOBAL CORP.
Executed: 2013-04-01
Assignee
VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
101 SOUTH HANEY ROAD, SUITE 1800, ST. LOUIS, MISSOURI, 63105
Covered Properties
(15)
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Method of Manufacturing a Printed Circuit Board
Method of Manufacturing a Multilayer Printed Wiring Board with Copper Wrap Plated Hole
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Manufacturing Methods of Multilayer Printed Circuit Board Having Stacked Via
Methods of Manufacturing Printed Circuit Boards
Patent:
8,020,292 →
Application:
12/772,086 →
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Methods of Manufacturing Printed Circuit Boards
Systems and Methods for Reducing Overhang on Electroplated Surfaces of Printed Circuit Boards
Methods of Manufacturing Printed Circuit Boards Using Parallel Processes to Interconnect with Subassemblies
Methods of Manufacturing a Printed Wiring Board Having Copper Wrap Plated Hole
Printed Circuit Board with Embedded Heater
Method of Manufacturing a Printed Circuit Board
Application:
13/594,971 →
Publication:
US 2013/0220675
Systems and Methods of Manufacturing Printed Circuit Boards Using Blind and Internal Micro Vias to Couple Subassemblies
Printed Circuit Board with Embedded Heater
Application:
61/586,691 →
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 14, 2012
From: WHITE, GIL
To: DDI GLOBAL CORP.
Reel/Frame 028379/0275 →
Release of Security Interest
Jun 22, 2012
From: JPMORGAN CHASE BANK, N.A.,
To: DDI GLOBAL CORP.
Reel/Frame 028425/0777 →
Change of Name
Jul 19, 2012
From: DYNAMIC DETAILS, INCORPORATED
To: DDI GLOBAL CORP.
Reel/Frame 028603/0854 →
Assignment of Assignor's Interest
Jan 10, 2014
From: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
To: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
Reel/Frame 031937/0500 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Change of Name
Sep 9, 2019
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 050314/0305 →
Merger
Sep 9, 2019
From: VIASYSTEMS GROUP, INC.
To: TTM TECHNOLOGIES, INC.
Reel/Frame 050313/0926 →
Change of Name
May 12, 2023
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, INC.
Reel/Frame 063635/0226 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Change of Name
May 26, 2026
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075627/0337 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →