IP Library › Assignment 063635/0226
Patent Assignment
Reel/Frame 063635/0226

Change of Name

Recorded: 2023-05-12 Pages: 3
Assignor
Assignee
TTM TECHNOLOGIES NORTH AMERICA, INC.
520 MARYVILLE CENTRE DRIVE, SUITE 400, ST. LOUIS, MISSOURI, 63141
Covered Properties (3)
Systems and Methods for Reducing Overhang on Electroplated Surfaces of Printed Circuit Boards
Patent: 9,017,540 →
Application: 13/162,408 →
Publication: US 2011/0308956
Method of Manufacturing a Printed Circuit Board
Application: 13/594,971 →
Publication: US 2013/0220675
Nano-Copper via Fill for Enhanced Thermal Conductivity of Plated Through-Hole Via
Patent: 9,736,947 →
Application: 14/572,636 →
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890) Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →