Patent Assignment
Reel/Frame 028603/0854
Change of Name
Recorded: 2012-07-19
Pages: 4
Assignor
DYNAMIC DETAILS, INCORPORATED
Executed: 2010-02-17
Assignee
DDI GLOBAL CORP.
101 SOUTH HANLEY ROAD, SUITE 1800, ST. LOUIS, MISSOURI, 63105
Covered Properties
(5)
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Method of Manufacturing a Printed Circuit Board
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Manufacturing Methods of Multilayer Printed Circuit Board Having Stacked Via
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest
Jun 22, 2012
From: JPMORGAN CHASE BANK, N.A.,
To: DDI GLOBAL CORP.
Reel/Frame 028425/0777 →
Change of Name
Dec 31, 2013
From: DDI GLOBAL CORP.
To: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
Reel/Frame 031863/0129 →
Assignment of Assignor's Interest
Jan 10, 2014
From: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
To: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
Reel/Frame 031937/0500 →
Patent Security Agreement-Term
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Patent Security Agreement-Abl
Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Change of Name
Sep 9, 2019
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 050314/0305 →
Patent Security Agreement (Abl)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan)
May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702)
Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →