IP Library › Assignment 028425/0777
Patent Assignment
Reel/Frame 028425/0777

Release of Security Interest

Recorded: 2012-06-22 Pages: 7
Assignor
JPMORGAN CHASE BANK, N.A.,
Executed: 2012-06-21
Assignee
DDI GLOBAL CORP.
1220 SIMON CIRCLE, ANAHEIM, CALIFORNIA, 92806
Covered Properties (10)
Additional Functionality Single Lammination Stacked via with Plated Through Holes for Multilayer Printed Circuit Boards
Methods of Manufacturing Printed Circuit Boards Using Parallel Processes to Interconnect with Subassemblies
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Patent: 7,523,545 →
Application: 11/706,473 →
Publication: US 2007/0246254
Method of Manufacturing a Printed Circuit Board
Patent: 8,250,751 →
Application: 12/070,811 →
Publication: US 2008/0196935
Method of Manufacturing a Multilayer Printed Wiring Board with Copper Wrap Plated Hole
Patent: 8,156,645 →
Application: 12/157,021 →
Publication: US 2008/0302468
Methods of Manufacturing Printed Circuit Boards with Stacked Micro Vias
Patent: 7,856,706 →
Application: 12/381,925 →
Publication: US 2009/0178274
Manufacturing Methods of Multilayer Printed Circuit Board Having Stacked Via
Patent: 8,453,322 →
Application: 12/539,172 →
Publication: US 2010/0038125
Methods of Manufacturing Printed Circuit Boards
Patent: 8,020,292 →
Application: 12/772,086 →
Methods of Manufacturing Printed Circuit Boards Using Internal Stacked Micro Vias to Couple Subassemblies
Application: 61/351,253 →
Systems and Methods for Reducing Overhang on Electroplated Surfaces of Printed Circuit Board
Application: 61/355,914 →
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Jul 19, 2012
From: DYNAMIC DETAILS, INCORPORATED
To: DDI GLOBAL CORP.
Reel/Frame 028603/0854 →
Change of Name Dec 31, 2013
From: DDI GLOBAL CORP.
To: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
Reel/Frame 031863/0129 →
Assignment of Assignor's Interest Jan 10, 2014
From: VIASYSTEMS NORTH AMERICA OPERATIONS, INC.
To: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
Reel/Frame 031937/0500 →
Patent Security Agreement-Term Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Patent Security Agreement-Abl Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Change of Name Sep 9, 2019
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 050314/0305 →
Patent Security Agreement (Abl) May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0702 →
Patent Security Agreement (Term Loan) May 30, 2023
From: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 063804/0745 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890) Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (063804/0702) Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TELEPHONICS CORPORATION; TTM TECHNOLOGIES, INC.; TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 075679/0852 →