Methods of manufacturing printed circuit boards with stacked micro vias
View Patent ↗A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.
1. A method of manufacturing at least a portion of a printed circuit board, the method comprising:
applying a lamination adhesive on a first plural-layer substrate comprising a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate;
applying a protective film on the lamination adhesive;
forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate;
filling at least one conductive paste into the at least one via formed in the lamination adhesive;
removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and
attaching the first plural-layer substrate with a second plural-layer substrate comprising a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.
2. The method of claim 1 , wherein the attaching of the first plural-layer substrate with the second plural-layer substrate comprises:
aligning the first plural-layer substrate with the second plural-layer substrate such that the lamination adhesive is between the first side of the first plural-layer substrate and the second side of the second plural-layer substrate and that the at least one second metal pad on the second side contacts the at least one conductive paste filled into the at least one via; and
curing the lamination adhesive substrates between the first side of the first plural-layer substrate and the second side of the second plural-layer substrate to laminate the first plural-layer substrate with the second plural-layer substrate.
3. The method of claim 1 , wherein the at least one via is formed by laser drilling.
4. The method of claim 1 , wherein the at least one via is formed by mechanical drilling.
5. The method of claim 1 , further comprising:
imaging at least one photo resist onto the first plural-layer substrate having a metal foil formed on the first side of the first pleural layer substrate;
etching off the metal foil from the first plural-layer substrate with exception of at least one part of the metal foil covered by the at least one photo resist; and
stripping off the at least one photo resist to expose the at least one part of the metal foil to form the at least one first metal pad on the first side of the first plural-layer substrate.
6. The method of claim 1 , wherein the at least one via has a diameter between about 0.004″ and about 0.010″.