IP Library › Assignment 035857/0333
Patent Assignment
Reel/Frame 035857/0333

Release of Security Interest

Recorded: 2015-06-08 Pages: 7
Assignor
Assignee
MERIX CORPORATION
101 SOUTH HANLEY ROAD, SUITE 400, ST. LOUIS, MISSOURI, 53105
Covered Properties (9)
Electrical Connector
Patent: 4,255,003 →
Application: 06/007,445 →
Fractionating Liquids
Patent: 4,394,219 →
Application: 06/287,035 →
Packing Unit and Method of Making
Patent: 4,600,544 →
Application: 06/553,949 →
Multilayer Interconnect Circuitry Using Photoimagenable Dielectric
Patent: 4,566,186 →
Application: 06/626,560 →
Probe Cable Assembly
Patent: 4,716,500 →
Application: 06/789,278 →
Flexible Circuit Strain Relief
Patent: 4,756,940 →
Application: 06/843,952 →
Process for Removal of Dissolved Copper from Solution
Patent: 4,950,326 →
Application: 07/345,865 →
Air-Dielectric Stripline
Patent: 5,712,607 →
Application: 08/631,580 →
Microelectronic Substrates with Thermally Conductive Pathways and Methods of Making Same
Patent: 7,741,566 →
Application: 10/555,899 →
Publication: US 2007/0272435
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement May 4, 2012
From: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 028158/0575 →
Patent Security Agreement-Term Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035851/0928 →
Release of Security Interest Jun 8, 2015
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: VIASYSTEMS, INC.; VIASYSTEMS CORPORATION (FORMERLY MERIX CORPORATION)
Reel/Frame 035858/0092 →
Patent Security Agreement-Abl Jun 8, 2015
From: TTM TECHNOLOGIES, INC.; VIASYSTEMS, INC.; VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035858/0890 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (035858/0890) Jun 2, 2026
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TTM TECHNOLOGIES, INC. (FORMERLY KNOWN AS VIASYSTEMS GROUP, INC. AND VIASYSTEMS, INC.); TTM TECHNOLOGIES NORTH AMERICA, LLC (FORMERLY KNOWN AS VIASYSTEMS TECHNOLOGIES CORP., L.L.C.)
Reel/Frame 075681/0922 →