Termination and Release of Security Interest in Patent Rights

Recorded: 2006-08-11 Received: 2007-12-04 Pages: 10

Assignor

JPMORGAN CHASE BANK N.A.

Executed: 2006-08-10

Assignee

VIASYSTEMS GROUP, INC.

101 SOUTH HANLEY ROAD, STE 400, ST. LOUIS, MO, 63105, UNITED STATES

Covered Properties (12)

Night Foot Splint

Application: 29/189,411 →

Bending an Optical Fiber into a Backplane

Application: 10/179,756 →

Optical fiber right angle transition

Application: 10/179,757 →

System and Method for Integrating Optical Layers in a Pcb for Inter-Board Communications

Application: 10/179,758 →

Indoor-outdoor equipment enclosure and method for assemblying the same

Application: 60/382,839 →

Folded box section and manufacturing process for a corner post of a standard rack frame

Application: 60/369,215 →

Rack frame structure and method of assembling same

Application: 60/368,390 →

Embedded waveguide and embedded electromagnetic shielding

Application: 10/046,323 →

Pcb Embedded and Surface Mounted Optical Distribution Systems

Application: 09/992,810 →

Fiber Optic Circuit Board Connector

Application: 10/051,418 →

HDI electrolytic plating system

Application: 60/344,417 →

Non-Circular Micro-Via

Application: 09/786,787 →