Patent Assignment
Reel/Frame 013732/0539
Assignment of Assignor's Interest
Recorded: 2003-02-04
Pages: 3
Assignors
SONG, YOUNG HEE
Executed: 2003-01-20
KANG, SA-YOON
Executed: 2003-01-21
SON, MIN YOUNG
Executed: 2003-01-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-GU, SUWON-CITY KYUNGKI-DO, REPUBLIC OF, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip, Chip Stack Package and Manufacturing Method